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Modu Will Be Attending Pack Expo International

Modu Will Be Attending Pack Expo International

Modu will be attending the Pack Expo International packaging trade show on October 14 – 17 at McCormick Place, Chicago, IL USA. Pack Expo International is the largest, most comprehensive packaging event in the world.

The trade show will feature:

  • 50,000 attendees from across 40+ vertical industries
  • 2,500+ exhibitors showcasing their latest packaging solutions and launching new products
  • 1.2 million+ net square feet of exhibits
  • Free educational sessions in venues on the show floor
  • The PACKage Printing Pavilion, this new 60,000 square-foot area showcases printing and converting technologies

Modu is located at booths 9025 and 9026 (floorplan). Come and visit us.

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