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Modu Will Be Attending Pack Expo International

Modu Will Be Attending Pack Expo International

Modu will be attending the Pack Expo International packaging trade show on October 14 – 17 at McCormick Place, Chicago, IL USA. Pack Expo International is the largest, most comprehensive packaging event in the world.

The trade show will feature:

  • 50,000 attendees from across 40+ vertical industries
  • 2,500+ exhibitors showcasing their latest packaging solutions and launching new products
  • 1.2 million+ net square feet of exhibits
  • Free educational sessions in venues on the show floor
  • The PACKage Printing Pavilion, this new 60,000 square-foot area showcases printing and converting technologies

Modu is located at booth 9025. (floorplan). Modu will be displaying a small sample of their state of the art conveyor systems both in Aluminum and Stainless Steel versions. Please come by and visit us to see our product display and to talk about any upcoming projects you may have.

Posted in: Exhibits

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